Kaip ir mynejau, padare rebolinga, plius padare copper mod'a. Temp max 80c, 
bandziau net zaidimus pastumdyti (idomumo deliai) GPU daugiau 82C pakile 
nebuvo. Kolkas viskas ok.
Nelaikys reiks kompa mesti. :)


Darenas

"Veritas" <vinusveritas@gmail.com> wrote in message 
news:j5dbvt$g4q$1@trimpas.omnitel.net...
> kaip tik beklaidziodamas po interneto platybes radau vieno zmogelio toki 
> paaiskinima apie nvidia cipus "
> i've done many researc, and in many cases, in the nvidia chips, the 
> defective part is the flip chip itself . The flip chip is the little 
> square at the center of the whole bga.
>
> the flip chip is bonded with the substrate (the green part of the whole 
> chip) exactly like a bga... yes, it has under itself many hard alloy 
> spheres, about 200 micron diameter....
>
> when you do reballing or reflow you are going to heat this small 
> connections too, so, the chip will work for that reason... and even if you 
> do a perfect rebballing and soldering on the board, thi chip will fail in 
> the future cause the problem are not the balls between bga and board( 
> second level connection) but are the small connection between the flip 
> chip and the substrate(first level connection)
>
>
> many times the problem is this, other time the problem is the second level 
> connection, but it is impossible to figure wich kind of fault are, so 
> replacing the chip with a new one it is the best deal."
>
> "Silwa"  parašė naujienų news:j4ok09$uic$1@trimpas.omnitel.net...
>
> Arunas, teisus. Esmė ne prilitavime prie plokštės. Problema čipe, o jei
> tiksliau, tai flip-chip technologijos niuansuose.
> O tokių "auksarankių" teko matyti. Iš pradžių atneša pakeisti
> pasilydžiusį korpusą, o paskui jau ir pačią plokštę remontui.
>
> On 2011.09.13 10:15, a wrote:
>> "Arunas-X"<ArunasXX@gmail.com>  wrote in message
>> news:j4muu0$mrg$1@trimpas.omnitel.net...
>>> nelitavime esme, o paciam cipe
>>
>> nesiruosiu gincytis su zmogum kuris isitikines savo teisumu.
>>
>>
>